Electrical device allowing for increased device densities

ABSTRACT

A device comprising a circuit, a lead having a first end connected to the circuit and having a second end, and a deformable structure connected to the second end of the lead. The invention may be embodied on a circuit board, so that the circuit board includes a substrate and a deformable structure connected to said substrate. Also disclosed is a device comprising a circuit having an active side and a non-active side, a package enclosing the active side of the circuit and not enclosing a portion of the non-active side of the circuit, and a lead having a first end connected to the active side of the circuit via a lead-over-chip connection, and having a second end extending from the package. Also disclosed is a device comprising a circuit and a lead formed from a flexible conductor, with the lead having a first end connected to the circuit.

CROSS REFERENCE TO RELATED APPLICATIONS

Not Applicable.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

Not Applicable.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention is directed to a device that can be made smallerand with improved electrical characteristics than prior art devices and,more particularly, to a semiconductor device that can be made with apackage that allows for greater device densities on circuit boards,shorter lead lengths, more tolerance to non-uniformities, and improvedcooling.

2. Description of the Background

Electronic products typically contain a large number of electricaldevices organized on one or more substrates, also known as circuitboards. The efficient packaging of those devices is an important factorin the product's performance. One way to improve performance is toincrease the density of electrical devices on the substrate. Forexample, density may be increased by decreasing the size of the devices,thereby increasing the number of devices that can be placed on a givensubstrate.

One way to increase device density is to use vertical packaging, whichplaces devices perpendicular to the substrate. Vertical packaging allowsfor many more devices to be placed on a substrate because verticallyoriented devices have smaller footprints than horizontally orienteddevices. However, vertical packaging is subject to package instability(i.e. tipping over), particularly during processing steps involving pooradhesion between the device and the substrate, such as solder reflow.That instability is caused, in part, by non-uniformities in both thesubstrate and device. As a result, vertical packaging requiresadditional steps to create more uniform devices and substrates, and tostabilize the devices during some processing steps.

Conventional devices and substrates also suffer from other problemscaused by non-uniformities. For example, bending of device leads andpoor contact between the device and substrate may result if the deviceand substrate are not uniform. Such problems require that device leadsbe lengthened to allow for greater flexibility to compensate for thenon-uniformities. Longer leads, however, may result in the lead bendingand possibly creating a short between conductors on the substrate. Inaddition, longer leads may cause detrimental electrical characteristics,such as increased resistance, increased capacitance, and decreasedspeed. Furthermore, longer leads tend to increase instability problemswhen there is poor adhesion between the device and the substrate.

Thus, a need exists for an improved device to allow for increased devicedensities without the deficiencies of the prior art.

BRIEF SUMMARY OF THE INVENTION

The present invention is direct to a device comprising a circuit, a leadhaving a first end connected to the circuit and having a second end, anda deformable structure connected to the second end of the lead. Theinvention may be embodied on a circuit board, so that the circuit boardincludes a substrate and a deformable structure connected to saidsubstrate.

The present invention is also directed to a device comprising a circuithaving an active side and a non-active side, a package enclosing theactive side of the circuit and not enclosing a portion of the non-activeside of the circuit, and a lead having a first end connected to theactive side of the circuit via a lead-over-chip connection, and having asecond end extending from the package.

The present invention is also directed to a device comprising a circuitand a lead formed from a flexible conductor, with the lead having afirst end connected to the circuit.

The present invention solves the shortcomings of the prior art byproviding for higher device densities, shorter lead lengths, and moretolerance of non-uniformities, such as those in devices and substrates.Those and other advantages and benefits of the present invention willbecome apparent from the description of the invention providedhereinbelow.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

For the present invention to be clearly understood and readilypracticed, the present invention will be described in conjunction withthe following figures wherein:

FIG. 1 is a perspective view of a circuit board including a substrate, adevice, and a deformable structure between the circuit and conductivepaths on the substrate;

FIG. 2 is a cross sectional view along line II-II of the circuit boardillustrated in FIG. 1;

FIG. 3 is a perspective view of a circuit board including deformablestructures in elongated form on the substrate;

FIG. 4 is a cross-sectional view of a device including a deformablestructure attached to leads of the device;

FIG. 5 is a perspective view of a device including an integrated circuitpartially enclosed in a package;

FIG. 6 is a cross-sectional view along line VI-VI of the deviceillustrated in FIG. 5;

FIG. 7 is a perspective view of a device including leads formed fromtab-tape;

FIG. 8 is a cross-sectional view along line VIII-VIII of the deviceillustrated in FIG. 7; and

FIG. 9 is a cross-sectional view of a device including leads formed frommultiple layered tab-tape.

DETAILED DESCRIPTION OF THE INVENTION

It is to be understood that the description of the invention has beensimplified to illustrate aspects that are relevant for a clearunderstanding of the present invention, while eliminating, for thepurpose of clarity, other elements. Those of ordinary skill in the artwill recognize that other elements may be desired and/or required.

FIG. 1 is a perspective view of a circuit board 10 including a substrate12, such as a circuit board, having conductive paths 14 for transmittingsignals, a device 16 having leads 18 for transmitting signals to andfrom the device 16, and a deformable structure 20 connecting thesubstrate 12 to the device 16.

The device 16 may be an integrated circuit, a discrete component, or anyother device that is connected to a substrate. In one embodiment of thepresent invention, the device 16 is a memory device. In that embodiment,the device may be dynamic memory or static memory. The leads 18 of thedevice 16 may be for surface mount connection to the substrate 12.

The deformable structures 20 connect the substrate 12 to the device 16.In the present embodiment, the deformable structures 20 connect theconductive paths 14 of the substrate 12 to the leads 18 of the device16. The deformable structures 20 may be connected to the substrate 12and the device 16 with conductive or non-conductive adhesives.Alternatively, the deformable structures 20 may themselves be adhesiveso that additional adhesive is not required.

The deformable structures 20 may be of a number of types and shapes. Forexample, the deformable structure may be of a structure for connecting asingle lead 18 to a single conductive path 14, as illustrated in FIG. 1.In that embodiment, the deformable structures 20 may be located atdiscrete locations on the substrate 12, such as at places where leads 18connect to conductive paths 14. Alternatively, a single deformablestructures 20 may connect several leads 18 to several conductive paths14, as described in more detail hereinbelow with respect to FIGS. 3 and4. The deformable structures 20 may be placed at each location on thesubstrate 12 where the leads 18 connect to the conductive paths 14.Alternatively, the deformable structures 20 may be selectively placed atlocations where non-uniformities are likely to exist. Thus, there may beas few as one deformable structure 20, or as many deformable structures20 as there are leads 18.

The deformable structures 20 may be compressed between the leads 18 andthe substrate 12. That ability to be compressed compensates fornon-uniformities that may exist, such as in the substrate 12, theconductive paths 14, the device 16, and the leads 18. That compensationreduces or eliminates bending of the leads 18 and poor contact betweenthe leads 18 and the conductive paths 14 that would otherwise be causedby the non-uniformities. Furthermore, the deformable structures 20eliminate the need to lengthen the leads 18, thereby allowing forshorter leads 16, shorter signal paths, and increased performance.Shortening the leads 18 also reduces or eliminates the risk of surfacemount leads rubbing the bottom of the device 16 or rubbing the substrate12, thereby reducing the risk of short circuits.

The deformable structures 20 may be any of several different materials.For example, the deformable structures 20 may be a polymer, such assilicone. The deformable structures 20 may also be resilient, such aswhen formed from elastomers, although the deformable structures 20 donot necessarily have to be resilient. The deformable structure 20 may beconductive or non-conductive, depending on the particular application.

FIG. 2 is a cross sectional view along line II-II of the circuit boardillustrated in FIG. 1. A conductor 24 may be disposed over thedeformable structure 20 and in contact with both the leads 18 and theconductive paths 14. The conductor 24 may be, for example, a conductiveadhesive or a conductive tape used to secure the leads 18 to thedeformable structures 20. The conductor 24 may be applied on individualdeformable structures to provide an electrical connection between onelead 18 and one conductive path 14. Alternatively, the conductor 24 maybe applied across several deformable structures 20 where an electricalconnection is desired between several leads and/or several conductivepaths 14

The conductor 24 may be eliminated if connection between the leads 18and the conductive paths 14 are not desired, such as if the leads 18 areonly needed to support the device 16. The conductor 24 may also beeliminated if the deformable structures 20 are conductive. In oneembodiment, the deformable structures 20 are both conductive andadhesive, thereby eliminating the need for additional adhesives andconductors, but still providing electrical connection between the leads18 and the conductive paths 14.

FIG. 3 is a perspective view of a circuit board 10 including deformablestructures 20 in elongated form on the substrate 12. The deformablestructures 20 may extend over part or all of the substrate 12. Thedeformable structures 20 may be non-conductive so that any one of thedeformable structures 20 may contact several conductive paths 14 andseveral leads 18 but not cause a short circuit. In that embodiment,conductors 24 may be used to electrically connect individual leads 18 toindividual conductive paths 14, as discussed hereinabove.

FIG. 4 is a cross-sectional view of a device 16 including deformablestructures 20 attached to the leads 18. In that embodiment, thedeformable structures 20 may be attached to the leads 18 of the device16 prior to connecting the device 16 to the substrate 12. As describedhereinabove, the deformable structures 20 may be adhesives, or adhesivesmay be used to attach the deformable structures 20 to the leads 18.

FIG. 5 is a perspective view of a device 16 including an integratedcircuit 30 partially enclosed by a package 32, and leads 18 extendingfrom the package 32. The device 16 may be, for example, an applicationspecific integrated circuit or a memory device. The device 16illustrated in FIG. 5, as well as the devices 16 described herein belowwith respect to FIGS. 6-9, may be used with or without the deformablestructures 20. If the device 16 is used without the deformablestructures 20, it may be applied directly to flex tape or conductivetraces on a substrate 12.

FIG. 6 is a cross-sectional view along line VI-VI of the device 16illustrated in FIG. 5. The integrated circuit 30 has an active area 38including electrically conductive connections to logic gates in theintegrated circuit 30. The integrated circuit 30 also includes anon-active area 40 which does not contain electrically conductiveconnections to logic gates forming the integrated circuit 30.

The package 32 encloses the active area 38 of the integrated circuit 30,as is conventionally done, but does not enclose a portion of thenon-active area 40. The non-enclosed portion of the non-active area 40is exposed to ambient environment. Exposing a portion of the non-activearea 40 of the integrated circuit 30 facilitates cooling of theintegrated circuit 30. In addition, exposing a portion of the integratedcircuit 30 allows for a smaller profile of the device 16, because thepackage 32 is thinner, thereby allowing for increased density of devices16 on a circuit board.

The leads 18 may be connected to the active area 38 of the integratedcircuit 30 with lead bonds 44 in a lead-over-chip manner. Alead-over-chip design offer an advantage of making connections near thecenter of the integrated circuit 30, as opposed to near the edge of theintegrated circuit 30. As a result, the edge of the active area 38 ofthe integrated circuit 30 may be engaged by the package 32 to moresecurely hold the integrated circuit 30. Alternatively, the leads 18 mayalso be connected to the integrated circuit 30 using a design other thanlead-over-chip. Two such examples are tab bonding and peripheral bondpads that provide for sufficient space near the edge of the integratedcircuit 30 to allow for engagement by the package 32. Furthermore, theintegrated circuit 30 may be engaged by the package 32 at only thesides, without engaging the active area 38

FIG. 7 is a perspective view of a device 16 including leads 18 formedfrom a flexible conductor adhesive, such as tab-tape. A portion of theleads 18 may be attached to the package 32 with the adhesive. Forexample, the leads 18 may be attached to the outside of the package 32from a point where the leads 18 exit the package to a point where theleads 18 are to be attached to another structure, such as a substrate.The leads 18 in that embodiment may be used with the deformablestructures 20 described hereinabove, and may also be used with exposedintegrated circuit 30 described hereinabove.

FIG. 8 is a cross-sectional view along line VIII-VIII of the device 16illustrated in FIG. 6. A spacer 50 may be used so that the leads 18 areaway from the package 32, thereby reducing the risk of the package 32contacting the substrate 12. The spacer 50 may be made of the samematerials as the deformable structure 20 described hereinabove withrespect to FIGS. 1-4, so that the spacer 50 compensates fornon-uniformities, such as on the substrate 12. The spacer 50 may also bea dielectric so as to insulate signals on the leads 18.

FIG. 9 is a cross-sectional view of a device 16 having leads 18 formedfrom multiple layers of tab-tape. That embodiment allows for increasedlead density. An additional spacer 52 may be placed between leads 18 toprevent a short between the leads 18. The spacer 52 may be made of thesame materials as the deformable structure 20 discussed hereinabove withrespect to FIGS. 1-4, so that the spacer 52 compensates fornon-uniformities, such as on the substrate 12. The spacer 52 may be adielectric so as to insulate signals on the leads 18.

The nature of the present invention and its preferred embodiments asdescribed herein allows the present invention to overcome many of thedifficulties of increasing the density of packages on a substrate. Thepresent invention can be used with or without a vertical packagingdesign, allowing for an increase in density through its method ofadjustment to non-uniformities. In addition, when adjusting tonon-uniformities on a substrate via the method explained herein, thereis a significant decrease in the risk that the lead from an integratedcircuit package will bend, break, or make poor contact with thesubstrate at the interconnect point. The present invention therebyensures improved electrical performance of IC packages.

The present invention as described herein may be used with or without Lshaped leads. When the present invention is used with L shaped leads,the risk that the base of such leads will rub the bottom of the package,even when the exposed portion of the L is minimized, is greatly reduced.The present invention also provides for the use of new, varied leadtypes, such as tape leads. These tape leads may be used in an over/underconfiguration, enhancing the number of interconnect points availablewithin the area covered by the IC package on the substrate. The use ofnon-standard lead configurations connected via an LOC method enables theexposure of one face of a die within the package, greatly enhancingthermal properties.

The present invention has been described in connection with thepreferred embodiments thereof. Those of ordinary skill in the art willrecognize that many modifications and variations may be employed. Forexample, the embodiments illustrated in FIGS. 5-9 may be used eitherwith or without the deformable structures 20 described with respect toFIGS. 1-4. All such modifications and variations are intended to becovered by the foregoing description and the following claims.

1-29. (canceled)
 30. A circuit board, comprising: a substrate; amechanically deformable structure attached to the substrate; and adevice secured to the substrate via the mechanically deformablestructure, wherein the device comprises at least one lead attached tothe mechanically deformable structure.
 31. The circuit board of claim30, wherein the device further comprises a circuit connected to the atleast one lead.
 32. The circuit board of claim 30, wherein the substratecomprises at least one non-uniform portion.
 33. The circuit board ofclaim 30, wherein the mechanically deformable structure is resilient.34. The circuit board of claim 30, further comprising a conductorconnected to the mechanically deformable structure.
 35. The circuitboard of claim 30, further comprising an adhesive for attaching themechanically deformable structure to the substrate and the lead.
 36. Thecircuit board of claim 35, wherein the mechanically deformable structureand the adhesive are electrically conductive.
 37. The circuit board ofclaim 35, wherein at least one of the mechanically deformable structureand the adhesive is electrically non-conductive.
 38. The circuit boardof claim 30, further comprising a second mechanically deformablestructure attached to the substrate and to at least one lead of thedevice.
 39. A circuit board, comprising: a substrate; and a mechanicallydeformable structure adhered to the substrate.
 40. The circuit board ofclaim 39, further comprising a device having at least one lead adheredto the mechanically deformable structure.
 41. The circuit board of claim40, wherein the device further comprises a circuit connected to the atleast one lead.
 42. The circuit board of claim 39, wherein the substratecomprises at least one non-uniform portion.
 43. The circuit board ofclaim 39, wherein the mechanically deformable structure is resilient.44. The circuit board of claim 39, further comprising a conductorconnected to the mechanically deformable structure.
 45. The circuitboard of claim 39, wherein the mechanically deformable structure isconductive.
 46. The circuit board of claim 39, wherein the mechanicallydeformable structure is non-conductive.
 47. The circuit board of claim40, further comprising a second mechanically deformable structureadhered to the substrate and to at least one lead of the device.